IMAPS Nordic

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Keynote Speakers

 

The Nordpac Conference is proud to announce exciting and informative Keynote addresses in the planary seesions during the conference:

 

Interconnection technology for next generation wearable and power electronics, Prof Katsuaki Suganuma, Osaka University

 

Professor Suganuma received the degree of Dr. Engineer from Tohoku University in 1982. He became a research assistant of ISIR (Institute of Scientific and Industrial Research), Osaka University in 1982, an associate professor of National Defense Academy in 1986, and a professor of ISIR of Osaka University in 1996. He was the director of Nanotechnology Center in 2007-2009 and the deputy director of ISIR in 2010-2012. He has worked on lead-free soldering, conductive adhesive, power electronics packaging and printed electronics. He published several books in these fields. He is currently in charge of the several projects such as Printed electronics standardization IEC TC119 Japan committee (JEITA), Chairmans of Printed Electronics Association of Japan and WGB systemintegration consortium

3D-Printing for Electronics Packaging – Current Status, Future Challenges, Chris Bailey, University of Greenwich

Professor Bailey is Director of the Computational Mechanics and Reliability Group at the University of Greenwich, UK. He obtained is PhD in multi-physics modelling in 1988, and an MBA in Technology Management in 1996. He has published over 300 papers on design, modelling, and simulation of electronics packaging technologies. He is a member of the Board of Governors for IEEE CPMT, Vice President for CPMT conferences, and is UK Chapter Chair for the IEEE CPMT and Reliability Societies. He is also a member of the technical working group on the new Heterogeneous Integration Roadmap leading the efforts on modelling and simulation.

 Trends shaping innovation in the ICT industry, Kristina Gold, Ericsson

Kristina Gold-  Director Technology Foresight within Ericsson Group Function Technology and Emerging Businesses. Main focus is the creation of a strategic viewpoint on the technology evolution across the ICT Industry. Kristina joined Ericsson in 2010 as Technology Manager for RBS Radio HW. The outcome: a new modular site solution with multi-standard, multi-band capabilities. Prior to joining Ericsson, she has held Management and Architect positions within SonyEricsson as well as Microsoft. Kristina is also engaged in academia as a board member within the Swedish National Infrastructure for Computing.

 

Roadmapping Heterogeneous Integration – A key to our future, Bill Bottoms, Third Millennium Test Solutions Inc.

Dr. Bottoms received a B.S. degree in Physics from Huntington College in Montgomery, Alabama in 1965, and a Ph.D in Solid State from Tulane University in New Orleans in 1969 and is currently Chairman of Third Millennium Test Solutions. He has worked as a faculty member in the department of electrical engineering at Princeton University, manager of Research and Development at Varian Associates, founding President of the Semiconductor Equipment Group of Varian Associates and general Partner of Patricof & Co. Ventures. He has served as Chairman and CEO of many companies both public and private.

Ultimately Dense and Efficient Future Computers,  Arvind Sridhar, IBM

Arvind Sridhar is a Post-doctoral Researcher in the Smart Systems Integration Group at IBM Research - Zurich. He received his PhD in Electrical Engineering from the Swiss Federal Institute of Technology (EPFL), Lausanne, in 2013. Dr. Sridhar joined IBM Research in 2014, and his primary research interests are electronic cooling, integrated power supplies and machine learning for vital signs monitoring. He has worked on various US DARPA, EU FP7/H2020, and Swiss National Science Foundation funded projects on advanced thermal packaging, on-chip power supplies and power generation. He is the author of 3D-ICE, an open source thermal simulation software for liquid-cooled ICs that is currently being used by more than 500 university and industrial research groups across the world. He has received Best Paper awards in the 2016 ASME Journal of Electronic Packaging and 2017 SEMI-THERM. In 2016, he received the IBM Outstanding Accomplishment award in Research as part of the group at IBM’s Zürich Research Laboratory that pioneered the interlayer cooling of 3D integrated circuits.

3D based fingerprint sensors, Pontus Jägemalm, Fingerprint cards  

Pontus Jägemalm is CTO and Head of R&D at Fingerprint Cards AB in Gothenburg, Sweden. Dr Jägemalm received his PhD from Chalmers University of Technology in 1999 and then joined the Technical University of Berlin as a post-doc. After a short period at Philips in Eindhoven, Holland, he joined Displaytech Inc, in Colorado USA, working with the development of ferroelectric liquid crystal on silicon micro-displays, as a technical lead and manager for the System Department. In 2007 he joined Fingerprint Cards AB in Gothenburg, Sweden, and has since contributed to the company’s development and strong growth, particularly in fingerprint sensors for mobile phones.