IMAPS Nordic

  info@imapsnordic.org

Abstract Guidelines

You are invited to submit a 300-500 word abstract that describes the scope, content and key points of your proposed paper. Abstracts must include results and can include graphics. The official language of all presentations is English.

The abstract is submitted into our conference portal, not as a document. However, you are welcome to upload a single image to accompany the text. 

To submit the abstract go to https://www.conftool.com/nordpac2018 and register as a new user og log on to your profile. Registration is free.

After login, go to "Your submissions"

Then click on "Abstract submission"

Fill in the author names, e-mails and affiliations

Then fill in the text of the abstract. This should of course be copied from a text file of some sort. Any images will not be included. To include figures you will be able to upload a document with the figures on the next page.

Then you will see the summary of the abstract.

To finalise your submission you have to upload a file. This can either be a single image (jpg or png), or a set of images (pdf). If you do not have any images in your abstract, upload a blank file.

Here we have uploaded the file figure1.

Press "Upload File(s)" and you should get a page confirming your submission.

NordPac 2019

Announcement:

 

The Nordic Conference on Microelectronics Packaging, NordPac 2019

will be held

11th – 13th June 2019 at the Technical University of Denmark, Lyngby, Denmark

 

Jointly arranged by IMAPS Nordic and IEEE EPS Nordic

 

We are proud to announce that the 2019 NordPac conference will be held in Denmark. The event brand NordPac was introduced in Gothenburg in 2017 as a collaboration between IMAPS Nordic and IEEE EPS Nordic. The conference will take place at VTT Technical Research Centre of Finland Ltd in Oulu. The IMAPS Nordic conference was here in 2014. 

Abstract Submission will open soon and will be done via our conference portal. Please see the Abstract Guidelines page for help. 

Full paper submission will aslo be done via our conference portal. Please provide three files:

  • Your paper in MS Word format 
  • Your paper in pdf format, with all fonts embedded 
  • A signed and scanned pdf of the copyright agreement.  

All approved, reviewed, papers will be included in the conference proceedings and submitted for inclusion to IEEE Xplore Digital Library (www.ieeexplore.ieee.org) after the authors’ approval. The paper must be original and not previously published. Avoid inclusion of Commercial content.

The paper should be 4 - 10 pages. Please download either the MS Word Template (.doc file) or the Latex-template (.zip file).

For students we have the possibility to have papers classified as Reviewed and published in both IEEE Xplore and IMAPS North America IMAPSource, see http://ieeexplore.ieee.org/ and http://www.imapsource.org.

The deadline for the final paper is May 22, but if you want your paper to be reviewed deadline is May 1st. Late papers are not published.

VISA information

If you require a VISA to enter Denmark, you may need an Invitation Letter. Please contact the organising commitee on This email address is being protected from spambots. You need JavaScript enabled to view it. to receive your letter. An invitation letter can only be issued to speakers.

As part of the annual IMAPS Nordic conference, PhD and Master Students are especially encouraged to submit an abstract. For this we have set up a Review process for those who need reviewed and published papers. This is a great opportunity to interact with the industrial and academic community at an international level (coming from inside and outside the Nordic countries).

Printed, flexible electronics

Medical electronics

Unique materials, PTF and ACF

OPTO-ELECTRICAL and LED

High temperature electronics, harsh environment

Sensor integration & applications

3D Advanced interconnect, advanced packaging

Wearable electronics

Ceramics: thick film, copper plated, DBC, LTCC

Reliability assessments, SPC and FMEA

 

 

 

EXHIBITION

We will have an industrial exhibition along with the technical sessions.  If you are interested, please contact: Dr. Daniel Nilsen Wright, at This email address is being protected from spambots. You need JavaScript enabled to view it.. See the Exhibition page foer details. 

 

 

 

 

Maps and Travel Information

Hotel

The hotel of choice will be listed here soon. 

Coctail Party

There will be a cocktail party on the 11th. Information will be updated. 

Locations 

A google map of the locations will be updated here. 

 

NordPac 2019 Exhibitor Info

Announcement:

 

The Nordic Conference on Microelectronics Packaging, NordPac 2019

will be held

11th – 13th June 2019 at the Technical University of Denmark, Lyngby, Denmark

 

Jointly arranged by IMAPS Nordic and IEEE EPS Nordic

 

It is our pleasure to announce that the IMAPS Nordic & IEEE EPS Nordic 2018 Conference on Microelectronics Packaging (NordPac) will be held 11th – 13th June 2018 at the Technical University of Denmark, in Lyngby, Denmark. This is the second time that IMAPS Nordic Chapter and IEEE EPS Nordic Chapter jointly organise this event. The event brings together both academics, as well as industry leaders, to discuss and debate state-of-the-art and future trends in microelectronics components, packaging, integration and manufacturing technologies. NordPac provides a perfect opportunity to hear the latest news and developments in the field. So mark the dates in your calendar today!

BACKGROUND

You and your company are hereby invited to participate in the exhibition during the 2019 annual IMAPS Nordic & IEEE EPS Nordic conference. The conference is designed to give maximum interaction between the delegates and the exhibitors.

The exhibition will be located in a room adjacent the main conference room and in the corridor, if needed. Coffee breaks will take place in the exhibition area.

  • We will offer table-top style exhibits only. You will have one draped table, two chairs, 230V power supply. You will be able to choose between a high, round table (Ø70 cm 110 cm high) or a low square table (50 cm x 140 cm 51 cm high). You are welcome to bring roll-ups and posters. We will supply walls for your posters. Price: €850!
  • Each exhibitor will be offered one free conference seat included in the price per “table”. The conference fee includes proceedings, lunch and dinner. The person utilizing this offer must register to the conference. Up to two additional conference tickets for colleagues can be purchased at €395 per person.
  • Your exhibitor PR-info will be presented in the conference program. In the plenary session on Monday all exhibitors may present themselves and their products (maximum one minute each).

This is the best opportunity for you to reach the microelectronics, packaging and SMT manufacturers and users in the Nordic area.

VENUE

Information about the venue will be updated.  

REGISTRATION

Information regarding registration will be updated. 

PRACTICALITIES

To ship your items to DTU prior to your arrival please make the shipment out to:

Information will be updated.  

 

Make sure to use the correct import/export codes on your proforma invoice to avoid paying tax on your items. Also, make sure to notify Markku on the arrival of your items.

 

About a month before the conference you should supply a one-page advertisement page for the conference program. Send a portrait layout pdf-file to This email address is being protected from spambots. You need JavaScript enabled to view it..

CONTACT  

If you have any further questions, do not hesitate to get in touch.

For questions regarding the venue and technical issues please contact

  • will be updated
  • will be updated

For questions regarding registration issues, please contact

  • Daniel Nilsen Wright (This email address is being protected from spambots. You need JavaScript enabled to view it., +47 93 44 10 38)

Please see www.nordpac.org for the latest updates.

 

Daniel Nilsen Wright

Exhibition host

This email address is being protected from spambots. You need JavaScript enabled to view it.