IMAPS Nordic

Short Courses

On Sunday the 18th, there will be held the following short courses at Chalmers University

Time Activity


0900 - 1130 Short course I: Humidity related failure issues in electronics, Rajan Ambat ,Technical University of Denmark

Fasrumet, MC2, Chalmers

1130 - 1230 Lunch, Sandwiches for short courses participant  

Outside the classrooms

1230 - 1500 Short Course cancelled  


1500 - 1520

Coffee & tea break

1520 - 1750

Short course III: Thermal management in electronics, Dr. Torbjörn Nilsson and Dr. Yifeng Fu, SAAB and Chalmers University of Technology resp.


Fasrumet, MC2, Chalmers

1810 -

Cocktail welcome party starting.


Wiljkanders, Chalmers compus

 Short course content descriptions and prices:

Short course I: Humidity related failure issues in electronics

The miniaturization of electronic systems and the explosive increase in their usage has increased the humidity related reliability issues of electronics devices and components especially having metal/alloys parts exposed on the Printed Circuit Board Assembly (PCBA) surface or embedded within the multi-layer laminate. Problems are compounded by the fact that these systems are built by multi-material combinations and additional accelerating factors such as humidity absorbing and corrosion causing process related residues, bias voltage, and unpredictable user environment. Demand for miniaturised device has resulted in higher density packing with reduction in component size and closer spacing thereby increasing the electric field, while thinner metallic parts needs only nano-grams levels of metal loss for causing corrosion failures. The reduced distances on the PCBA surface also result in tiny volume of water formed from humidity to connect between terminals.

Today the knowledge on humidity related reliability issues is very limited. The short course focuses on: (i) basics of humidity interaction with PCBA surface causing corrosion failures, (ii) PCBA production process and cleanliness aspects in related to humidity related reliability issues, (iii) influence of PCBA architecture on humidity related failures, (iv) essential tips and thump rules on how to control humidity related failures, and (v) some aspects of device level design in controlling humidity entry into the device.

Dr. Rajan Ambat is currently Professor of Corrosion and Surface Engineering at Department of Mechanical Engineering, Technical University of Denmark. He is also the Manager for the Centre for Electronic Corrosion/CreCon Industrial Consortium at DTU. Climatic reliability of Electronics is a major research activity in his group in close collaboration with a number of major European industries including Danfoss, Vestas, Grundfos, Bosch, and Eltek. Various research activities on climatic reliability include material, component, PCBA, and device level issues and mitigation methods. He is also the Chairman for the Working Party on Corrosion reliability of electronic devices under European Federation of Corrosion. He is also part of the editorial board of corrosion journals.

Short course III: Thermal management in electronics

Continuous shrinking of the transistors has allowed more components and functions to be integrated in a single unit area. At the same time it increases the power density in microsystems to a very high level that brings great challenges to traditional cooling solutions which has a typical cooling capability of about 50 W/cm2. Furthermore, the growth of chip functionality and complexity has introduced many hotspots onto chip surfaces, which results in extremely high local heat fluxes. This adds extra difficulties to an efficient cooling because the high power density dramatically decreases the cooling capability of conventional heat sinks. A poor cooling does not only lower the performance of electronic products but also significantly shortens their life time. Therefore, there is a strong demand in electronics industry to develop high-performance thermal management solutions.

The short course consists of four interwoven parts. We will start with an introduction of the basic heat transport principles. This will be followed by the overview of current thermal management solutions and challenges that thermal engineers work with today. In the third part, we will focus on the thermal interface materials, i.e. TIMs, which play a key role along the heat dissipation path in microsystems. The course will end with an outlook to the future and more or less emerging materials and technologies such as heat pipes, diamond, carbon nanotube, graphene, and 3D printed cooling structures.

Torbjörn Nilsson is a technical specialist at Saab AB, responsible for the development of cooling systems. The emphasis is on electronics cooling and the future of related technologies for military radars and lasers. Since 2004 he has been specialist in the areas reliability and electronics packaging at Ericsson and subsequently at Saab. He is also an adjunct professor at Chalmers University of Technology in the area of electronics packaging. Dr. Nilsson gives, on an unregular basis, the full-day course “Thermal Management of Electronics” in the Nordic countries.


Dr Yifeng Fu holds a PHD degree from Chalmers University of Technology in microelectronics.  Before joining Chalmers, he worked in SHT Smart High Tech AB as project manager and research manager, where he was in charge of the overall research and development of materials and technologies.  His research interest covers carbon nano- and 2D materials for 3D electronics packaging. This includes the synthesis and processing of carbon nanotubes, carbon nanofibers, nanowires, graphene and related 2D materials as well as their heterostructures for thermal management, interconnect and device fabrication. He has published more than 70 papers in journals and proceedings.



Number of courses






1 course

250 Euro

350 Euro

450 Euro

550 Euro

2 courses

400 Euro

500 Euro

600 Euro

700 Euro

3 courses

500 Euro

600 Euro

700 Euro

800 Euro

For registration to the short courses, please download the registration form.