IMAPS Nordic 2017
Nordic Conference on Microelectronics Packaging, NordPac
in technical co-sponsorship with IEEE CPMT
18th – 20th June 2017, Läppstiftet Conference Center, Gothenburg, Sweden
Registration is open! Download the registration form here (Excel file).
It is our pleasure to announce that the IMAPS Nordic Conference on Microelectronics Packaging (NordPac) will be held 18th – 20th June 2017 in Gothenburg, Sweden. This is first time that IMAPS Nordic Chapter and IEEE CPMT Nordic Chapter jointly organise this event. The event brings together both academics as well as industry leaders to discuss and debate the state-of-the-art and future trends in microelectronics components, packaging, integration and manufacturing technologies. NordPac provides a perfect opportunity to hear the latest news and developments in the field. So mark the dates in your calendar today!
The abstract submission has been closed and the authors have been notified. Nordpac has received 38 abstracts within the various topcis below. Click here for the preliminary program.
|Materials and Processes for Packaging||Advanced Packaging and System Integration|
|Interconnect Technology||Thermal Management|
|1D, 2D, 2.5D and 3D integration technology||Signal Integrity|
|Emerging Technology||Reliability, Material and Process Modelling|
|Reliability Testing and Characterization||Design for Recycling in Electronics Packaging|
|Applications||Life Cycle Assessment|
PUBLICATION OF PAPERS
All approved, reviewed, papers will be included in the conference proceedings and submitted for inclusion to IEEE Xplore Digital Library (www.ieeexplore.ieee.org) after the authors’ approval. The paper must be original and not previously published. Avoid inclusion of Commercial content.
BEST STUDENT PAPER AWARD
PROFESSIONAL DEVELOPMENT SHORT COURSES
On Sunday the 18th of June 2017 there will be held three short courses at Chalmers University. please see the Short courses page for details and how to register.
NordPac 2017 STEERING COMMITTEE chair: Paul Collander, Poltronic Ltd, Finland
NordPac 2017 TECHNICAL COMMITTEE chair: Johan Liu, Chalmers University of Technology, Sweden
NordPac 2017 LOCAL ORGANISING COMMITTEE chair: Yifeng Fu, Chalmers University of Technology, Sweden
NordPac 2017 Student ORGANIZING COMMITTEE chair: Andreas Nylander, Chalmers University of Technology, Sweden