IMAPS Nordic

Conference 2017 Old

Download the Exhibitor Invitation



IMAPS Nordic 2017 

Nordic Conference on Microelectronics Packaging, NordPac

in technical co-sponsorship with IEEE CPMT 

18th – 20th June 2017, Läppstiftet Conference Center, Gothenburg, Sweden


Registration is open! Download the registration form here (Excel file).

It is our pleasure to announce that the IMAPS Nordic Conference on Microelectronics Packaging (NordPac) will be held 18th – 20th June 2017 in Gothenburg, SwedenThis is first time that IMAPS Nordic Chapter and IEEE CPMT Nordic Chapter jointly organise this event. The event brings together both academics as well as industry leaders to discuss and debate the state-of-the-art and future trends in microelectronics components, packaging, integration and manufacturing technologies. NordPac provides a perfect opportunity to hear the latest news and developments in the field. So mark the dates in your calendar today!


The abstract submission has been closed and the authors have been notified. Nordpac has received 38 abstracts within the various topcis below. Click here for the preliminary program.

 Materials and Processes for Packaging  Advanced Packaging and System Integration
 Interconnect Technology  Thermal Management
 1D, 2D, 2.5D and 3D integration technology  Signal Integrity
Emerging Technology  Reliability, Material and Process Modelling
Reliability Testing and Characterization  Design for Recycling in Electronics Packaging
Applications Life Cycle Assessment



All approved, reviewed, papers will be included in the conference proceedings and submitted for inclusion to IEEE Xplore Digital Library ( after the authors’ approval. The paper must be original and not previously published. Avoid inclusion of Commercial content.

The paper should be 4 - 10 pages. Please download either the MS Word Template (.doc file) or the Latex-template (.zip file).

VISA information

If you require a VISA to enter Sweden, you may need an Invitation Letter. Please contact the organising commitee on This email address is being protected from spambots. You need JavaScript enabled to view it. to receive your letter. An invitation letter can only be issued to speakers.


We will have an industrial exhibition along with the technical sessions. We already have 10 exhibitors and 2 sponsors. Please see our invitation to exhibitors for details If you are interested, please contact: Dr. Gustaf Mårtensson, industrial liaison committee chair and Dr. Daniel Nilsen Wright, at This email address is being protected from spambots. You need JavaScript enabled to view it..


There will be an award given to the best student paper(s) presented. Please indicate that you are a student when submitting the abstract. Any questions can be sent to This email address is being protected from spambots. You need JavaScript enabled to view it..


On Sunday the 18th of June 2017 there will be held three short courses at Chalmers University. please see the Short courses page for details and how to register.

NordPac 2017 STEERING COMMITTEE chair: Paul Collander, Poltronic Ltd, Finland

NordPac 2017 TECHNICAL COMMITTEE chair: Johan Liu, Chalmers University of Technology, Sweden

NordPac 2017 LOCAL ORGANISING COMMITTEE chair: Yifeng Fu, Chalmers University of Technology, Sweden

NordPac 2017 Student ORGANIZING COMMITTEE chair: Andreas Nylander, Chalmers University of Technology, Sweden