IMAPS Nordic

  info@imapsnordic.org

Keynote Speakers

 

The Nordpac Conference is proud to announce exciting and informative Keynote addresses in the planary seesions during the conference:

 

Interconnection technology for next generation wearable and power electronics, Prof Katsuaki Suganuma, Osaka University

 

Professor Suganuma received the degree of Dr. Engineer from Tohoku University in 1982. He became a research assistant of ISIR (Institute of Scientific and Industrial Research), Osaka University in 1982, an associate professor of National Defense Academy in 1986, and a professor of ISIR of Osaka University in 1996. He was the director of Nanotechnology Center in 2007-2009 and the deputy director of ISIR in 2010-2012. He has worked on lead-free soldering, conductive adhesive, power electronics packaging and printed electronics. He published several books in these fields. He is currently in charge of the several projects such as Printed electronics standardization IEC TC119 Japan committee (JEITA), Chairmans of Printed Electronics Association of Japan and WGB systemintegration consortium

3D-Printing for Electronics Packaging – Current Status, Future Challenges, Chris Bailey, University of Greenwich

Professor Bailey is Director of the Computational Mechanics and Reliability Group at the University of Greenwich, UK. He obtained is PhD in multi-physics modelling in 1988, and an MBA in Technology Management in 1996. He has published over 300 papers on design, modelling, and simulation of electronics packaging technologies. He is a member of the Board of Governors for IEEE CPMT, Vice President for CPMT conferences, and is UK Chapter Chair for the IEEE CPMT and Reliability Societies. He is also a member of the technical working group on the new Heterogeneous Integration Roadmap leading the efforts on modelling and simulation.

 Trends shaping innovation in the ICT industry, Kristina Gold, Ericsson

Kristina Gold-  Director Technology Foresight within Ericsson Group Function Technology and Emerging Businesses. Main focus is the creation of a strategic viewpoint on the technology evolution across the ICT Industry. Kristina joined Ericsson in 2010 as Technology Manager for RBS Radio HW. The outcome: a new modular site solution with multi-standard, multi-band capabilities. Prior to joining Ericsson, she has held Management and Architect positions within SonyEricsson as well as Microsoft. Kristina is also engaged in academia as a board member within the Swedish National Infrastructure for Computing.

 

Roadmapping Heterogeneous Integration – A key to our future, Bill Bottoms, Third Millennium Test Solutions Inc.

Dr. Bottoms received a B.S. degree in Physics from Huntington College in Montgomery, Alabama in 1965, and a Ph.D in Solid State from Tulane University in New Orleans in 1969 and is currently Chairman of Third Millennium Test Solutions. He has worked as a faculty member in the department of electrical engineering at Princeton University, manager of Research and Development at Varian Associates, founding President of the Semiconductor Equipment Group of Varian Associates and general Partner of Patricof & Co. Ventures. He has served as Chairman and CEO of many companies both public and private.

Ultimately Dense and Efficient Future Computers,  Arvind Sridhar, IBM

Arvind Sridhar is a Post-doctoral Researcher in the Smart Systems Integration Group at IBM Research - Zurich. He received his PhD in Electrical Engineering from the Swiss Federal Institute of Technology (EPFL), Lausanne, in 2013. Dr. Sridhar joined IBM Research in 2014, and his primary research interests are electronic cooling, integrated power supplies and machine learning for vital signs monitoring. He has worked on various US DARPA, EU FP7/H2020, and Swiss National Science Foundation funded projects on advanced thermal packaging, on-chip power supplies and power generation. He is the author of 3D-ICE, an open source thermal simulation software for liquid-cooled ICs that is currently being used by more than 500 university and industrial research groups across the world. He has received Best Paper awards in the 2016 ASME Journal of Electronic Packaging and 2017 SEMI-THERM. In 2016, he received the IBM Outstanding Accomplishment award in Research as part of the group at IBM’s Zürich Research Laboratory that pioneered the interlayer cooling of 3D integrated circuits.

3D based fingerprint sensors, Pontus Jägemalm, Fingerprint cards  

Pontus Jägemalm is CTO and Head of R&D at Fingerprint Cards AB in Gothenburg, Sweden. Dr Jägemalm received his PhD from Chalmers University of Technology in 1999 and then joined the Technical University of Berlin as a post-doc. After a short period at Philips in Eindhoven, Holland, he joined Displaytech Inc, in Colorado USA, working with the development of ferroelectric liquid crystal on silicon micro-displays, as a technical lead and manager for the System Department. In 2007 he joined Fingerprint Cards AB in Gothenburg, Sweden, and has since contributed to the company’s development and strong growth, particularly in fingerprint sensors for mobile phones.

 

 

 

Technical Committee

The Nordpac Conference is proud to announce that the following persons are part of the Nordpac Technical Commitee:

  1. Knut E Aasmundstveit, Vestfold University College, Norway
  2. Sergio Manzetti, Fjordforsk, Norway
  3. Mervi Paulasto-Kröckel, Aalto University, Finland
  4. Lilei Ye, SHT Grafilm AB, Sweden
  5. Nikos Logotethis, SHT Smart High Tech AB, Sweden
  6. Wei Mu, Fingerprint cards AB, Sweden
  7. Wenqi Zhang, Huajin Semiconductors Co, China
  8. Yan Zhang, Shanghai University, China
  9. Xiuzhen Lu,Shanghai University, China
  10. George Deligeorgis, FORTH, Greece
  11. Jianwen Dong, Dow Chemicals, USA
  12. Mircea Dragoman, ITM, Romanian
  13. Luca Pierantoni, UNIVPM, Italy
  14. Chris Bailey, University of Greenwich, UK
  15. Karlheinz Bock, Dresden University, Germany
  16. Mircea Modreanu, Tyndall, Ireland
  17. Katsuaki Suganuma, Osaka University, Japan

Exhibition invitation 2017

IMAPS Nordic & IEEE CPMT Nordic 2017 Conference on Microelectronics Packaging

18th – 20th June 2017, Läppstiftet Conference Center, Gothenburg, Sweden

 

EXHIBITORS AT NordPac 2017

 

It is our pleasure to announce that the IMAPS Nordic & IEEE CPMT Nordic 2017 Conference on Microelectronics Packaging (NordPac) will be held 18th – 20th June 2017 in Gothenburg, Sweden. This is first time that IMAPS Nordic Chapter and IEEE CPMT Nordic Chapter jointly organise this event. The event brings together both academics, as well as industry leaders, to discuss and debate state-of-the-art and future trends in microelectronics components, packaging, integration and manufacturing technologies. NordPac provides a perfect opportunity to hear the latest news and developments in the field. So mark the dates in your calendar today!

 

BACKGROUND

You and your company are hereby invited to participate in the exhibition during the 2017 annual IMAPS Nordic & IEEE CPMT Nordic conference held at Läppstiftet Conference Center, Gothenburg, Sweden. The conference is designed to give maximum interaction between the delegates and the exhibitors.

The exhibition is located in a more than 200 m2 large room adjacent the two conference rooms. Coffee breaks will take place in the exhibition area.

  • We will offer table-top style exhibits only. You will have one draped table, two chairs, 230V power supply. You are welcome to bring roll-ups or similar and your own walls as long as the total width will be less than 1.5m. Price: €850
  • Each exhibitor will be offered one free conference seat included in the price per “table”. The conference fee includes proceedings, lunch and dinner. The person utilizing this offer must register to the conference. Additional conference tickets for colleagues can be purchased.
  • Your exhibitor PR-info will be presented in the conference program. After the plenary session on Monday all exhibitors may present themselves and their products (maximum one minute each).

This is the best opportunity for you to reach the microelectronics, packaging and SMT manufacturers and users in the Nordic area.

EXHIBITION                      

We will have an industrial exhibition along with the technical sessions. If you are interested, please contact: Dr. Gustaf Mårtensson, industrial liaison committee chair and Dr. Daniel Nilsen Wright, at This email address is being protected from spambots. You need JavaScript enabled to view it..

For the latest information about the conference and the exhibition, visit our homepage at www.nordpac.org or send email to This email address is being protected from spambots. You need JavaScript enabled to view it. or to the Exhibition Host at exhibition@nordpac.org.

To register, please download the registration form and send to This email address is being protected from spambots. You need JavaScript enabled to view it..

More information will be made available continuously on the conference homepage.

 

Gustaf Mårtensson

Exhibition host

This email address is being protected from spambots. You need JavaScript enabled to view it.

Exhibition

 

EXHIBITORS at NordPac 2017, 19th - 20th of June

NordPac is proud to present 14 exhibitors at this year's conference. Below is a list of the exhibitors and a map of their booth locations.

 

Practical information:

Lappstiftet will be open for exhibitors to set up their exhibition on Sunday from 16:00 to 18:00. On Monday the facilities will be open from 07:30 for setup purposes. Dismantling can start on Tuesday at 15:00.

Any shipments prior to the conference should be clearly marked with "NordPac 2017" and sent to:

Läppstiftet Konferens

Lilla Bommen 1

411 04 Göteborg

contact: Anna Wadell  ( 031 - 15 61 35, This email address is being protected from spambots. You need JavaScript enabled to view it. )