The 2023 IMAPS Nordic Conference on Microelectronics Packaging, NordPac
12-14th of June 2023
Oslo Science Park, Oslo, Norway
Call for papers
We are proud to announce that the NordPac 2023 conference will be held at Oslo Science Park in Oslo, Norway. This is a perfect opportunity for you to present your revolutionary work within the field of microelectronic packaging while enjoying the normally beautiful weather in Oslo in June.
We hereby invite you to prepare an abstract for the conference. For NordPac 2023 we have expanded the possibilities for how you want to present you work. We will open three submission tracks:
- Track 1 will require a full paper submission (4-6 pages). Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. (http://ieeexplore.ieee.org/).
- Track 2 will only require an extended abstract (1-2 pages) and will only be published in the conference proceedings.
- Track 3 is reserved for commercial white papers (1-4 pages) and will only be published in the conference proceedings. Presentations from all three tracks can appear in the same technical session.
The abstract submission deadline for all three tracks is January 31st, 2023.
Acceptance will be given within February 28th. After this, the three tracks follow different submission deadlines as indicated in the table below.
For full instructions on how to submit your paper and information on review process flow, please go to www.nordpac.org
Summary of deadlines
|Conference portal open for submission||October 2022|
|Abstract submission||January 31st , 2023|
|Feedback on abstract||February 28th, 2023|
|Track 1 – Full paper submission||April 30th, 2023|
|Track 2 – Extended abstract submission||May 15th, 2023|
|Track 3 – Commercial white paper submission||May 15th, 2023|
|Notification of acceptance of all submissions||June 1st, 2023|
Proposed topics of microelectronics and packaging include:
|Optoelectronics||Harsh environment Applications|
|Advanced Packaging||Electronics Reliability & Quality|
|Materials & Processes||Medical electronics|
|Power electronics||Wearable electronics|
|Green Technologies||Printed electronics|
|Advanced packaging for MEMS & sensors & sensor systems|
Special topic for Track 2
Things don’t always go how you plan, especially if you are doing a Ph.D! If you have such an experience you want to share, either to help others in the same situation avoid making the same mistake or to get feedback from the microelectronics and packaging community, this is your chance. Use this chance to practice presenting your work and get recommendation on how to succeed next time!
About the conference
The event brand NordPac was introduced in Gothenburg in 2017 as a collaboration between IMAPS Nordic and IEEE Electronics Packaging Society (EPS) Nordic. NordPac prides itself on being a small and specialised conference where networking is easy.
Reviewed papers will be published in IEEE-Xplore with a licence to publish. The Licence allows the author to retain the copyright for the work and can publish it six months after the work has been published in IEEE-Xplore.
The five best reviewed papers will also be published in IMAPS North America IMAPSource, and http://www.imapsource.org.
More information to come.