Complementary short courses at Nordpac 2023
At NordPac 2023 we have the pleasure of offering two short courses. These will be free of charge for all participants that have registered for the full conference.
Both courses will be held on Monday the 12th of June at Oslo Science Park. A complimentary lunch will be served.
Time | Course title | About the author |
09:00 – 12:00 |
Fan-out, Fan-in, and Heterogeneous Integration Packaging
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Fan-out wafer/panel-level packaging has been getting lots of tractions since TSMC used their integrated fan-out to package the application processor chipset for the iPhone 7. In this lecture, the following topics will be presented and discussed. Emphasis is placed on the fundamentals and latest developments of these areas in the past few years. Fan-in packaging has been used for many years. Their future trends will also be explored. In this lecture, a six-side molded fan-in wafer level package and its reliability will be presented. Heterogeneous integration (HI) uses packaging technology to integrate dissimilar chips, photonic devices, and/or components (either side-by-side, stacked, or both) with different sizes and functions, and from different fabless design houses, foundries, wafer sizes, and feature sizes into a system or subsystem on a common package substrate. For the next few years, we will see more implementations of a higher level of HI packaging, whether it is for time-to-market, performance, form factor, power consumption or cost. In this lecture, the introduction, recent advances, and trends in HI packaging will be presented. Course Outline:
Who Should Attend? If you (students, engineers, and managers) are involved with any aspect of the electronics industry, you should attend this course. It is equally suited for R&D professionals and scientists. The lectures are based on the publications by many distinguish authors and the books (by the lecturer) such as Fan-Out Wafer-Level Packaging (Springer, 2018), Heterogeneous Integration (Springer, 2019), Semiconductor Advanced Packaging (Springer, 2021). and Chiplet Design and Heterogeneous Integration Packaging (Springer, 2023). Each attendee will receive more than 200 pages of lecture notes. |
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12:00 – 13:00 | Lunch | |
13:00 – 16:00 |
Solid-Liquid Interdiffusion (SLID) Bonding – for Challenges in Microsystem Bonding
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Knut Eilif Aasmundtveit (University of SouthEast Norway) & Vesa Vuorinen (Aalto University). |
Registration
To register for the short courses, simply select these events during the registration to the conference. Your selection can be edited at a later time, so if you are hindered from coming due to change of plans, please edit your entry accordingly. Remember to add any dietary requirements if needed.