Complementary short courses at Nordpac 2023

At NordPac 2023 we have the pleasure of offering two short courses. These will be free of charge for all participants that have registered for the full conference.

Both courses will be held on Monday the 12th of June at Oslo Science Park. A complimentary lunch will be served.

Time Course title About the author
09:00 – 12:00

Fan-out, Fan-in, and Heterogeneous Integration Packaging

 

John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging and SMT assembly, has published more than 515 peer-reviewed papers (375 are the principal investigator), 40 issued and pending US patents (25 are the principal inventor), and 23 textbooks (all are the first author) on, e.g., Advanced MEMS Packaging (McGraw-Hill, 2010), Reliability of RoHS compliant 2D & 3D IC Interconnects (McGraw-Hill, 2011), Through-Silicon Via (TSV) for 3D Integration (McGraw-Hill, 2013), 3D IC Integration and Packaging (McGraw-Hill, 2016), and Assembly and Reliability of Lead-Free Solder Joints (Springer, 2020). John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow and has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share.

Fan-out wafer/panel-level packaging has been getting lots of tractions since TSMC used their integrated fan-out to package the application processor chipset for the iPhone 7. In this lecture, the following topics will be presented and discussed. Emphasis is placed on the fundamentals and latest developments of these areas in the past few years. Fan-in packaging has been used for many years. Their future trends will also be explored. In this lecture, a six-side molded fan-in wafer level package and its reliability will be presented. Heterogeneous integration (HI) uses packaging technology to integrate dissimilar chips, photonic devices, and/or components (either side-by-side, stacked, or both) with different sizes and functions, and from different fabless design houses, foundries, wafer sizes, and feature sizes into a system or subsystem on a common package substrate. For the next few years, we will see more implementations of a higher level of HI packaging, whether it is for time-to-market, performance, form factor, power consumption or cost. In this lecture, the introduction, recent advances, and trends in HI packaging will be presented.

Course Outline:

  1. Fan-out wafer/panel-level Packaging
  2. Formation of FOWLP: (a) Chip-First (Die Face-Down), (b) Chip-First (Die Face-Up), and (c) Chip-Last (or RDL-First)
  3. Fabrication of Redistribution Layers (RDLs): (a) Polymer and ECD Cu + Etching, (b) PECVD and Cu Damascene + CMP, (c) Hybrid RDLs, and (d) Laser drill + LDI + PCB Cu-plating + Etching
  4. Formation of FOPLP: (a) Chip-First (Die Face-Down), (b) Chip-First (Die Face-Up), and (c) Chip-Last (or RDL-First)
  5. TSMC InFO: (a) InFO-PoP, and (b) InFO_AiP Driven by 5G mmWave
  6. Samsung PLP: (a) PoP for Smart Watches and (b) SiP SbS for Smartphones
  7. Warpages: (a) Warpage Types and (b) Allowable of Warpages
  8. Reliability of FOWLP and FOPLP: (a) Thermal-Cycling Test, (b) Thermal-Cycling Simulations, (c) Drop Test, and (d) Drop Simulations
  9. Examples: (a) Chip-First Panel-Level Fan-Out Packaging of Mini-LED for RGB-Display, (b) Chip-Last Panel-Level Fan-Out Packaging of Application Processor Chipset, (c) 2.3D IC Integration with Chip-First Fan-Out RDL-Interposers, and (d) 2.3D IC Integration with Chip-Last Fan-Out RDL-Interposers
  10. Fan-in Wafer-Level Packaging
  11. 6-sided Molding Wafer-Level Chip-Scale Package (WLCSP)
  12. Reliability of 6-sided Molded WLCSP
  13. Heterogenous Integration (HI)
  14. Classifications of HI
  15. HI Packaging on Organic Substrates: many examples
  16. HI Packaging on Silicon Substrates (TSV-Interposers): many examples: (a) Leti, (b) IME, (c) HKUST, (d) ITRI, (e) Xilinx/TSMC, (f) Altera/TSMC, (g) NVidia/TSMC, (h) AMD/UMC, (i) AMD’s Active Interposer, (j) Intel’s FOVEROS, (k) TSMC’s SoIC, and (l) Samsung’s X-Cube
  17. HI Packaging on Silicon Substrates (TSV-Less Interposers) such as Bridges: (a) Intel’s EMIB, (b) IBM’s DBHi, (c) Applied Materials’ Bridge Embedded in Fan-Out EMC, (d) SPIL’s FO-EB, (e) TSMC’s LSI, (f) ASE’s sFOCoS, (g) IME’s EFI, (h) Amkor’s S-Connect Fan-Out Interposer, and (i) UCIe
  18. HI Packaging on Ceramic Substrate: one example
  19. HI Packaging on Fan-Out RDL for High Performance Applications: many examples: (a) STATSChipPac’s FOFC-eWLB, (b) ASE’s FOCoS, (c) MediaTek’s FO-RDLs, (d) TSMC’s InFO_oS and InFO_MS, (e) Samsung’s Si-Less RDL Interposer, (f) TSMC’s RDL-Interposer, (g) ASE’s FOCoS (Chip-Last), (h) Shinko’s Organic RDL-Interposer, and (i) Unimicron’s Hybrid Substrate
  20. Assembly Technologies for Chiplet Design and HI Packaging: (a) SMT, (b) Solder Bumped Flip Chip, (c) CoW, (d) WoW, (e) TCB, and (f) Bumpless Cu-Cu Hybrid Bonding
  21. Trends in Fan-out, Fan-in, and HI Packaging

Who Should Attend?

If you (students, engineers, and managers) are involved with any aspect of the electronics industry, you should attend this course. It is equally suited for R&D professionals and scientists. The lectures are based on the publications by many distinguish authors and the books (by the lecturer) such as Fan-Out Wafer-Level Packaging (Springer, 2018), Heterogeneous Integration (Springer, 2019), Semiconductor Advanced Packaging (Springer, 2021). and Chiplet Design and Heterogeneous Integration Packaging (Springer, 2023). Each attendee will receive more than 200 pages of lecture notes.

12:00 – 13:00 Lunch
13:00 – 16:00

Solid-Liquid Interdiffusion (SLID) Bonding – for Challenges in Microsystem Bonding

 

Knut Eilif Aasmundtveit (University of SouthEast Norway) & Vesa Vuorinen (Aalto University).

Registration

To register for the short courses, simply select these events during the registration to the conference. Your selection can be edited at a later time, so if you are hindered from coming due to change of plans, please edit your entry accordingly. Remember to add any dietary requirements if needed.