IMAPS Nordic Officers
Heidi Lundén joined IMAPS Nordic board in 2019 after several active years in the IMAPS events and was elected President in 2022. Heidi holds a MSc (in Tech.) in materials science from Tampere University of Technology (TUT), Finland. She started in harsh metal industry ending up in to the world of glass and miniaturization in 2013. At SCHOTT Primoceler she is responsible for reliability and quality of hermetic glass packages. Finding and developing novel test methods for small volume packages, having end applications for example in aerospace and medical, is crucial part of her expertise.
Daniel Nilsen Wright has served as IMAPS Nordic secretary since 2016. He waspresident of IMAPS Nordic in 2019-2021. He is currently the President of IMAPS Europe.
He is in charge of the IMAPS Nordic webpages. Daniel has an MChem in Chemical Physics from the University of Liverpool and a Ph.D in Physics from the Univerisyt of Oslo. He has worked 10 years in silicon solar cell technology and in the last 6 years in advanced packaging and interconnect at SINTEF Digital in Oslo. In January 2019, he moved to SINTEF MinaLab which researches and develops MEMS technology.
Dr Dag Andersson is Group Manager of Electronics at RISE IVF, a group that focuses on packaging and reliability, where he started as a project manager in 1997. He earned his Ph.D. in Physics at the University of Göteborg, Sweden in 1989. From 1990-1997 he held various research positions at FOM-AMOLF Institute in Amsterdam, Cornell University, Ithaca NY, and Chalmers University of Technology, Gothenburg, Sweden. He has been project and work package manager for several national, Nordic, and European
projects. He has been the coordinator of COSIVU (FP7) and WP manager in e.g. Smarter-SI (H2020).
Anders E. Petersen
Anders E. Petersen has been vice president of IMAPS Nordic since 2016. Anders holds a M.Sc.E.E. from the Technical University of Denmark (DTU) and a Ph.D.-degree in optical measurements for power applications also from DTU. He has worked 7 years in the power industry with optical measurements, power quality and small-scale combined heat-and-power generation. In year 2000 he joined the Danish hearing aid company Oticon where he is currently holding a position as micro-electronics interconnect and packaging specialist in the R&D department.”
Paul Collander has been a member of IMAPS Nordic since 1974 when he started in the microelectronics world and a Board member since 1986. For 30 years he has been with Nokia, starting with setting up the first hybrid production line and when Nokia sold out all PCB and hybrid manufacturing lines he was more involved in searching new manufacturing technologies and to work on the advanced technology supply chain. November 2003 he set up his own consulting and networking business, Poltronic. In the Board his role is among other things being contact point to the IMAPS European Liaison Committee.
Terho Kutilainen has served as Treasurer of IMAPS Nordic from the beginning of 1997. Treasurer’s main responsibility consists of accounting and any financial matters of the society.
He holds a MSc EE degree from Oulu University and an eMBA degree from Oulu Business School. He works currently with business and technology development related tasks at Poltronic Ltd as a share holder. He has held managerial and specialist positions in R&D, sales and business administration at Aspocomp Plc, mainly in the field of ceramic micro modules. 2001 he was Manager of Packaging and Interconnection section in Business Development and Research group of Aspocomp.
Dr Johan Liu graduated with a master and a Ph.D. degree in materials science from the Royal Institute of Technology, Sweden. Before joining Chalmers University of Technology, he served in various positions at the Swedish Institute for Production Engineering Research (IVF) as project manager, group leader and division manager. He is currently a chair professor in electronics production and head of Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience in Chalmers University of Technology, Sweden and a short term visiting professor at Shanghai University, China.
Dr. Rajan Ambat is currently Professor of Corrosion and Surface Engineering at Division of Materials and Surface Engineering, Department of Mechanical Engineering, Technical University of Denmark. He is also the Manager for the Centre for Electronic Corrosion (CELCORR) and CreCon Industrial Consortium on climatic reliability of electronics at DTU and Research Manager for the Corrosion node of Danish Hydrocarbon Research and Technology Centre. Key research activity in his group is on humidity robustness of electronics focussing on understanding the effect at component, PCBA, and Systems level, elucidating failure mechanisms, controlling parameters and models, and intrinsic and extrinsic methods to improve reliability. Presently he is also the Chairman for the Working Party on Corrosion reliability of electronic devices under European Federation of Corrosion. He is part of the editorial board for various corrosion and electrochemistry journals and held visiting professorship and other academic positions/responsibilities in many universities. Presently he is Honorary Professor of Amity University, India. He has published more than 250 scientific papers, patents, and other contributions.