Preliminary Program

Notes: The current program is preliminary and might be subjected to changes.

Tuesday, 11 June 2024

Time Events Comments
10:00 – 13:00
Short course 1  by Dr. Martin Letz, Schott AG
“Semiconductor packaging using structured glass panels as platform” 
 For participants with full NordPac conference ticket.
13:00 – 13:45 Lunch break For participants with full NordPac conference ticket.
14:00 – 17:30 Collaborative technical event with Business Finland and Business Tampere Tickets available for participants registered with NordPac conference.

Notes: Limited number of tickets on “first comes first served” basis. Please register for this event during the registration for NordPac via conftool.

  • Keynote on Overview of Chips & Packaging by ASE
  • Finnish Roadmap on Semiconductor strategy
  • Panel discussion on packaging industry in Finland
  • Sponsor and Exhibitor presentations
18:00 – 21:00 Welcome Reception For participants registered for the collaborative technical event.

 

Wednesday, 12 June 2024

Time Events Comments
08:30 – 11:00 Short course 2 For participants with full NordPac conference ticket.
09:00 – 11:15 Exhibition opens Open to all registered participants.
11:00 – 11:30 Coffee and Tea break in exhibition area
11:30 – 11:45 Opening session
11:45 – 12:15 Keynote 1 by Ralph W. Bernstein (PhD), SINTEF Digital, Norway

“The European Chips Act: Opportunities and Challenges”

 For participants with full NordPac conference ticket.
12:15 – 13:00 Lunch break For participants with full NordPac conference ticket.
13:00 – 13:45 Keynote 2 by Professor Leena Ukkonen, Tampere University, Finland

“Textile-based Wearable Antennas and Interconnections in Body-centric Wireless Systems”

 For participants with full NordPac conference ticket.
13:45 – 14:15 Coffee and Tea break in exhibition area
14:15 – 16:15 Technical Workshop chaired by Professor Mircea Guina, Tampere University

“Photonics-electronics integration and co-packaging. From technology to applications”

 Tentative topics:

  • Codesign perspective
  • Advanced hybrid integration process
  • Medical and sensing applications
  • Panel discussions on trends and Pilot Line activities
19:00 – Conference Dinner  For participants with dinner ticket.

 

Thursday, 13 June 2024

Time Events Comments
09:00 – 11:00 Technical sessions  For participants with full NordPac conference ticket.
11:00 – 11:30 Coffee and Tea break in exhibition area
11:30 – 12:15 Keynote 3 by Dr. Olli Salmela, Nokia Bell Labs

“From Reliability of Mobile Phone Packages to Advanced Solutions for Telecom Base Stations and Renewable Energy”

  For participants with full NordPac conference ticket.
12:15 – 13:00 Lunch break  For participants with full NordPac conference ticket.
13:00 – 15:00 Technical sessions  For participants with full NordPac conference ticket.
15:00 – 15:15 Coffee and Tea break in exhibition area
15:15 – 15:45 Keynote 4 by Dr. Shailesh Singh Chouhan, Luleå University of Technology, Sweden

“A Fully Additive Manufacturing Approach for the Fabrication of Interconnects, Onboard, and Embedded Passives for HDI-Printed Circuit Boards”

  For participants with full NordPac conference ticket.
15:45 – 16:00 Closing session Closing Nordpac 2024. Announce NordPac 2025.