|Title: From Reliability of Mobile Phone Packages to Advanced Solutions for Telecom Base Stations and Renewable Energy
Dr. Olli Salmela
Reliability Engineering Manager at Nokia Bell Labs
Adjunct Professor at Aalto University and University of Oulu, Finland
|In his keynote speech, Dr. Olli Salmela will cover a wide range of topics that he has studied during his career both at university and industry. Starting from conformal coating materials made of inherently conductive polymers and closing to his current areas of interest related to technologies that enable sustainability improvements at electronics industry.
During his career, Dr. Salmela has supported both mobile phone and telecom infrastructure products. Early in his career, he studied the reliability of MCM-L technology that was used in the world’s first smart phone, Nokia Communicator. MCM-L proved to be rugged technology that enabled significantly higher packaging density. While working at Nokia Telecommunications, MCM-C technology was taken into use for critical RF components. MCM-C could embed high-Q passive components in the substrate. MCM-C technology was productized in early WCDMA radio products.
Due to RoHS directive, Nokia proactively started using lead-free solder materials, although at the time telecom infrastructure was still exempted from the regulation. In the studies Dr. Salmela performed, it was proven that lead-free solder materials can safely be used even in case of telecom products, where long lifetime is expected. The fatigue models Dr. Salmela created are still in active use both in the industry and in the academia.
In the end of his speech, Dr. Salmela will cover Liquid Cooling and Virtual Power Plant (VPP) technologies that his team has created and that are currently commercially available. Liquid Cooling can reduce the base station’s CO2 footprint by 80% and VPP is an enabling technology for wider use of renewable energy, such as solar and wind power.
|Title: The European Chips Act: Opportunities and Challenges
Ralph W. Bernstein (PhD)
Senior Business Developer, SINTEF Digital, Norway
|Dr. Ralph W. Bernstein has more than twenty years of management experience, including technology companies, commercialization, startups, research, and academia. His talk addresses opportunities and challenges raising with the recent European chips act.
Digital technologies play a key role in achieving a sustainable, fair, and competitive future; often referred to as the green and digital, twin, transition. In this context the EU Commissioner for the Internal Market, Thierry Breton, Commissioner for Internal highlights the importance of chip technologies: “Without chips, no digital transition, no green transition, no technological leadership.” As a response to the chip crisis during the Covid pandemic, and considerable geopolitical uncertainty, the European Commission has, hence, launched The European Chips Act. The Chips Act is a comprehensive initiative aimed at strengthening Europe’s competitiveness as well as secure supply of chip technologies and applications. The European Chips Act is not only about building new chip factories to ensure security of supply. It will also be an essential contribution to digitalization and thus, the green transition. To achieve this, it is crucial to strengthen Europe’s research and technology leadership and to address the skills shortage. Research and Technology organizations (RTOs) will consequently be key players in establishing important new capacities like pilot lines, competence centers, as well R&D and innovation capability in the field of new chip technologies and applications. There are several ongoing initiatives both on networks of new pilot lines and competence centers that will require substantial funding support both nationally and through the EU system. Such programs call for coordinated actions between RTOs, academia, industry, and governments.
|Title: Textile-based Wearable Antennas and Interconnections in Body-centric Wireless Systems
Professor at Faculty of Medicine and Health Technology, Tampere University
|In this presentation, we will focus on different aspects of body-centric wireless communication utilizing textile-based antennas and interconnections. We will present different antenna topologies for data and power transfer through tissue, in vitro and in vivo studies on implantable intracranial pressure (ICP) sensors and give insight and analysis on wireless link reliability in tissue environment when textile-based antennas are used. We will also present radio frequency identification (RFID)-based implant platform and communication method. Moreover, we will focus on differences and challenges of in vivo environment compared to laboratory phantoms and tissue models.