The IMAPS Nordic 2017

Nordic Conference on Microelectronics Packaging, NordPac

in technical co-sponsorship with IEEE CPMT 

was held on

18^th – 20^th June 2017 at Läppstiftet Conference Center, Gothenburg, Sweden

IMAPS Nordic and IEEE CPMT would like to thank the orgnanising committee in the successful organisation of the 2017 NordPac Conference!

The NordPac 2017 conference had over 80 participants contributing to a lively and friendly conference with five keynote speakers and 13 exhibitors. The proceedings from the conference can be found at IEEE here.

Keynote speakers

Prof Katsuaki Suganuma Osaka University	Kristina Gold, Ericsson	Bill Bottoms Third Millennium Test Solutions Inc.	Arvind Sridhar IBM	Pontus Jägemalm Fingerprint cards
Interconnection technology for next generation wearable and power electronics	Trends shaping innovation in the ICT industry	Roadmapping Heterogeneous Integration – A key to our future,	Ultimately Dense and Efficient Future Computers	3D based fingerprint sensors

Short courses

As a part of the conference, two short courses were orgenised on relevant topics.

Dr. Rajan Ambat Technical Univerity of Denmark	Torbjörn Nilsson SAAB	Dr. Yifeng Fu Chalmers Univerity
Humidity related failure issues in electronics	Thermal management in electronics.

Exhibitors and sponsors

Exhibitors:

Best Student Paper Award

The Best Paper Student Award was given to Selin Tolunay Wipf from IHP Microelectronics for her paper titled “Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance”.

Attendance