• IMAPS Nordic
  • info{@}imapsnordic.org
    IMAPS NordicIMAPS NordicIMAPS NordicIMAPS Nordic
    • Main
    • Membership
    • IMAPS
      • Officers
      • Constitution
      • Chapter
    • NordPac
      • Call for papers
      • Travel
      • Abstract Submission
      • NordPac Registration
      • Accomodation
      • Short courses
      • Program
      • Exhibitors at NordPac
      • Exhibitor Invitation
    • News
    • Events
    • EU Network
    • Home
    • 2017 IMAPS Nordic Conference

    2017 IMAPS Nordic Conference

    Nordic Conference on Microelectronics Packaging

    The IMAPS Nordic 2017

    Nordic Conference on Microelectronics Packaging, NordPac

    in technical co-sponsorship with IEEE CPMT 

    was held on

    18th – 20th June 2017 at Läppstiftet Conference Center, Gothenburg, Sweden

     

    IMAPS Nordic and IEEE CPMT would like to thank the orgnanising committee in the successful organisation of the 2017 NordPac Conference!

    The NordPac 2017 conference had over 80 participants contributing to a lively and friendly conference with five keynote speakers and 13 exhibitors. The proceedings from the conference can be found at IEEE here.

    Keynote speakers

    Prof Katsuaki Suganuma

    Osaka University

     Kristina Gold,

    Ericsson

     Bill Bottoms

    Third Millennium Test Solutions Inc.

    Arvind Sridhar

    IBM

    Pontus Jägemalm

    Fingerprint cards

    Interconnection technology for next generation wearable and power electronics  Trends shaping innovation in the ICT industry  Roadmapping Heterogeneous Integration – A key to our future,  Ultimately Dense and Efficient Future Computers  3D based fingerprint sensors
           

    Short courses

    As a part of the conference, two short courses were orgenised on relevant topics.

    Dr. Rajan Ambat

    Technical Univerity of Denmark

    Torbjörn Nilsson

    SAAB

     Dr. Yifeng Fu

    Chalmers Univerity

    Humidity related failure issues in electronics Thermal management in electronics.

     

    Exhibitors and sponsors

    Exhibitors:

     

     

     

     

    Best Student Paper Award

    The Best Paper Student Award was given to Selin Tolunay Wipf from IHP Microelectronics for her paper titled “Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance”.

    Attendance

    Share

    Event-Details

    Date

    18 Jun 2017 - 20 Jun 2017

    Location

    Läppstiftet Conference Center, Gothenburg, Sweden

    Become a Member!
    IMAPS Europe. All Rights Reserved | Privacy Policy | Imprint