IMAPS Nordic and IEEE CPMT would like to thank the orgnanising committee in the successful organisation of the 2017 NordPac Conference!
The NordPac 2017 conference had over 80 participants contributing to a lively and friendly conference with five keynote speakers and 13 exhibitors. The proceedings from the conference can be found at IEEE here.
|Prof Katsuaki Suganuma
| Kristina Gold,
| Bill Bottoms
Third Millennium Test Solutions Inc.
|Interconnection technology for next generation wearable and power electronics||Trends shaping innovation in the ICT industry||Roadmapping Heterogeneous Integration – A key to our future,||Ultimately Dense and Efficient Future Computers||3D based fingerprint sensors|
As a part of the conference, two short courses were orgenised on relevant topics.
|Dr. Rajan Ambat
Technical Univerity of Denmark
| Dr. Yifeng Fu
|Humidity related failure issues in electronics||Thermal management in electronics.|
The Best Paper Student Award was given to Selin Tolunay Wipf from IHP Microelectronics for her paper titled “Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance”.