Keynotes
 |
Title: PLA-Based Sustainable PCBs – a Possible Path for Greener Electronics
Prof. Attila Géczy Budapest University of Technology and Economics |
| Abstract
Sustainable electronics are in the focus of research from the electron device level to the larger electronic assemblies and appliances. One possible path of turning the mindset to ecological and evironmentally friendly technologies is to revise the material set and adjust the current standards to alternative possibilities. PCBs are a significant part of the generated e-waste and a non-negligible aspect of our devices’ life cycle, so a credible path is to investigate the possibility of alternative composites and their end-of-life processing. Flax-reinforced, flame-retarded PLA can be a serious contender in the near future in the green electronics field, and the presentation is focusing on the recent advances, the possible applications and comparisons based on IPC and further standards, to show the potential of these substrates, and to present novel aspects of waste-PCB processing with the technique of bio-leaching. |
|
 |
Title: Realising the power of rail – how power electronics packaging and systems integration can shape the future of sustainable mobilityGanesh ChandramouliHead of Innovation, Strategy and Portfolio at Alstom in SwedenSpeaker bio: Ganesh Chandramouli has more than 20 years of experience in railway electric propulsion technology. He has spent most of his career at Alstom and its predecessor companies Bombardier and Adtranz, holding various leading positions in product development, product management, and innovation. Through the course of his career, he has led the development and launch of several innovative products and solutions for sustainable mobility including one of the first demonstrations of energy efficient Silicon Carbide based propulsion in Stockholm’s subway. Currently, he leads internal and external innovation activities for Alstom’s rolling stock product line in Sweden. This includes a portfolio covering Alstom’s involvement in funded projects in the area of power electronics such as PowerizeD, E2Packman and Moore4Power (EU Chips JU) as well as building an open test environment for electric powertrains at the Alstom Test and Technology Centre Powerlab in Västerås. |
| Abstract
From the harshest winters to monsoons and sandstorms, railways transport passengers and goods all around the world in service lives spanning 30 years and more. The backbone of sustainable mobility today and tomorrow, increasing demands on capacity, energy efficiency and digitalisation drive the evolution of new technologies. How can we harness the benefits they promise, while cost effectively ensuring safe and reliable operation? All this, in the complex integrated system of systems that modern railways represent. |
|
| Title: From Silicon to Systems: Optimizing Advanced Packaging for High-Performance Integration
Jean-Francois Sauty Senior Technical Program Manager, ASE Speaker bio: Jean-Francois Sauty is Senior Technical Program Manager at ASE Europe, where he supports advanced packaging development and innovation for European customers across a broad range of semiconductor applications. |
|
| Abstract
As the semiconductor industry moves beyond the traditional scaling benefits of Moore’s Law, advanced packaging is becoming a critical enabler of next-generation system performance, heterogeneous integration, and compute scalability. |
|
