EXHIBITORS and SPONSORS

NordPac offers a combination of interesting keynotes and technical sessions with the latest news in the field and an interactive exhibition. The exhibition enables direct onsite interaction between participants. Being a sponsor brings the images of company and its products/services more visible to customers and participants. The welcoming reception, coffee breaks and the conference dinner are great platforms for networking with your academic and industry colleagues. We have received positive feedback on creating open and warm atmosphere in our events.

NordPac offers various packages for exhibition and sponsorship. For more details please visit: Exhibitors and Sponsors Invitation

The registration for exhibitors and sponsors could be realized at  REGISTRATION . You first need to register an account. This will then enable you to register to the conference.

For any inquiries, please do not hesitate to get in touch with Exhibitor Chair Markku Lahti or Co-Chair Hoang-Vu Nguyen at info@nordpac.org

SPONSORS

Platinum sponsor
Silver sponsor

 PacTech-Packaging Technologies GmbH, established 1995 and a group company of NAGASE & CO., LTD., manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level bumping & packaging contract manufacturing out of Nauen, Germany (HQ), and through the 100% subsidiaries PacTech USA Inc., Silicon Valley, USA and PacTech ASIA Sdn., Bhd., Penang, Malaysia.

The equipment product line consists of solder jetting equipment (SB2-Jet), wafer-level solder ball transfer systems (Ultra-SB2), wafer-level solder rework equipment (Ultra-SB2 300 WLR), laser assisted (LAB, LCB, LAR) flip-chip bonders (Laplace) and automatic wet chemical lines for high volume electroless NiAu & NiPdAu bumping (PacLine 300 A50).

Those unique and highly innovative manufacturing systems are providing solutions for today’s tasks and challenges in advanced packaging applications.

The wafer level packaging & bumping subcontractor services consist of electroless Ni/Au, Ni/Pd and Ni/Pd/Au Under Bump Metallization (UBM) for either wafer level solder bumping for Flip Chip or WLCSP or for wire bonding. Additionally, PacTech offers AOI, X-Ray, SEM, BCB Repassivation, wafer-level redistribution, wafer backside metallization, wafer thinning, laser backside marking, wafer dicing, chip singulation, tape & reel services.

 

Exhibitors

 

 
 

 
 

 

 Inseto is a trusted provider of cutting-edge solutions for research, industry, and manufacturing. With a focus on microelectronics, semiconductor, and related fields, we offer a comprehensive range of products and services. Our commitment to excellence, technical expertise, and customer satisfaction sets us apart. Whether you need high-performance adhesives, precision equipment, or materials for assembly, Inseto is here to support your success.

At Inseto, we understand the critical role packaging plays in ensuring the integrity and reliability of microelectronic devices. Our state-of-the-art packaging equipment is designed to meet the demanding requirements of modern manufacturing processes. Here are some highlights:

  • Die Bonders: Our die bonders provide precise placement of semiconductor chips onto substrates. Whether you’re working with wire bonding, flip-chip, or other advanced techniques, our die bonders offer exceptional accuracy and repeatability.
  • Wire Bonders: Inseto offers wire bonding solutions for both wedge bonding and ball bonding. These machines create robust electrical connections between semiconductor components and lead frames or substrates.
  • Dispensing Systems: Our dispensing systems handle adhesive, encapsulant, and underfill materials. They ensure uniform coverage, minimize voids, and enhance overall reliability.
  • Reflow Ovens: Our standalone IR vacuum reflow ovens are ideal for R&D, low-volume pilot lines, and medium-volume batch production.

Remember, all our packaging equipment is backed by expert technical support and training.
 

 

 At Microcertec, we are specialized in the fabrication of customized 3D advanced ceramic- and technical glass-based devices and micro-structured components for high-tech applications in harsh environments, including defense, aerospace, submarine, cryogenics, and medical instrument industries.

Using a variety of high-end fabrication processes, we achieve micrometric resolutions in the production of our products. Particularly, our unique fabrication technology of 3D interconnect devices, CI3D, enables high-density and intricate packaging of microelectronic, optoelectronic, and photonic devices within highly reliable structures. Offering unparalleled flexibility in design, this technology serves as an innovation facilitator for the realization of high-performance and high-demand systems utilized in nanosatellites, quantum devices, MEMS, lasers, PICs, and surgical robots.
 

 

 We provide the most advanced, high-precision 3D printers and grayscale lithography systems with application-specific solutions. As the leading innovator and market leader in additive manufacturing, we provide application-specific solutions at the nano-, micro-, meso- and macro-scale. Our patented technology empowers cutting-edge science and drives industrial innovations in various sectors, including microoptics, micromechanics, biomedical engineering, and photonics technologies.
 

 

 Optim Wafer Services offer, high quality bespoke wafer & substrate processing services such as thin & polish, Grinding, Taiko, Polishing, CMP, Edge trimming, Chamfering, Rounding, Re-sizing, Dicing, DBG & Cleaning of wafers substrates and materials of various sizes and shapes.
 

 

 ROARTIS develops adhesives, coatings, resins and sinter materials for (micro-) electronic and industrial applications. Our IQ-BOND, IQ-CAST, IQ-INQ and IQ-SINTER brands stand for innovative, high quality materials, typically used in demanding, high reliability markets.

With state of the art laboratories and manufacturing in Belgium, Roartis has historically optimized their manufacturing facilities to respond to offer high mix, low to medium volume applications.