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    • Main
    • News
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    • Constitution
    • Chapter
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  • NordPac 2025
    • Program
    • Keynotes
    • NordPac Final Paper Preparation
    • Distinguished Lecture
    • Workshops
    • Call for Papers
    • NordPac 2025 Venue
    • Exhibitor Invitation
  • Prices & Registration
  • Events
    • Previous Conferences
    • IMAPS Europe event campus
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  • NordPac 2019

NordPac 2019

The Nordic Conference on Microelectronics Packaging

The IMAPS Nordic 2019

Nordic Conference on Microelectronics Packaging, NordPac

in technical co-sponsorship with IEEE CPMT 

was held at

Denmark’s Technical University (DTU), Lyngby, Denmerk

IMAPS Nordic and IEEE CPMT would like to thank the orgnanising committee in the successful organisation of the 2019 NordPac Conference!

The NordPac 2018 conference had over 40 participants contributing to a lively and friendly conference with two keynote speakers and 10 exhibitors. The proceedings from the conference can be found at IEEE here.

We would like to thank our exhibitors.

 

 

 

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Event-Details

Date

11 Jun 2019 - 13 Jun 2019

Location

Technical University of Denmark, Lyngby, Denmark

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