• IMAPS Nordic
  • info{@}imapsnordic.org
    IMAPS NordicIMAPS NordicIMAPS NordicIMAPS Nordic
    • Main
    • IMAPS
      • Officers
      • Membership
      • Constitution
      • Chapter
    • NordPac
      • NordPac Abstract Submission
      • NordPac Registration
      • Exhibitor Invitation
    • News
    • Events
    • EU Network
    • Home
    • Events
    • NordPac 2019

    NordPac 2019

    The Nordic Conference on Microelectronics Packaging

    We are proud to announce that the 2019 NordPac conference will be held in Denmark. The event brand NordPac was introduced in Gothenburg in 2017 as a collaboration between IMAPS Nordic and IEEE EPS Nordic. The conference will take place at Technical Univeristy of Denmark, Lyngby, Denmark. For registration, please go to our conference portal.

    Abstract Submission will open soon and will be done via our conference portal. Please see the Abstract Guidelinespage for help. 

    Full paper submission will aslo be done via our conference portal. Please provide three files:

    • Your paper in MS Word format
    • Your paper in pdf format, with all fonts embedded
    • A signed and scanned pdf of the copyright agreement.

    All approved, reviewed, papers will be included in the conference proceedings and submitted for inclusion to IEEE Xplore Digital Library (www.ieeexplore.ieee.org) after the authors’ approval. The paper must be original and not previously published. Avoid inclusion of Commercial content.

    The paper should be 4 – 10 pages. Please download either the MS Word Template (.doc file) or the Latex-template (.zip file).

    For students we have the possibility to have papers classified as Reviewed and published in both IEEE Xplore and IMAPS North America IMAPSource, see http://ieeexplore.ieee.org/ and http://www.imapsource.org.

    The deadline for the final paper is May 22, but if you want your paper to be reviewed deadline is May 1st. Late papers are not published.

    VISA information

    If you require a VISA to enter Denmark, you may need an Invitation Letter. Please contact the organising commitee on Conference@nordpac.org to receive your letter. An invitation letter can only be issued to speakers.

    As part of the annual IMAPS Nordic conference, PhD and Master Students are especially encouraged to submit an abstract. For this we have set up a Review process for those who need reviewed and published papers. This is a great opportunity to interact with the industrial and academic community at an international level (coming from inside and outside the Nordic countries).

    Printed, flexible electronics Medical electronics
    Unique materials, PTF and ACF OPTO-ELECTRICAL and LED
    High temperature electronics, harsh environment Sensor integration & applications
    3D Advanced interconnect, advanced packaging Wearable electronics
    Ceramics: thick film, copper plated, DBC, LTCC Reliability assessments, SPC and FMEA
       

     

    Share

    Event-Details

    Date

    11 Jun 2019 - 13 Jun 2019

    Location

    Technical University of Denmark, Lyngby, Denmark

    Links
    Website
    Become a Member!
    IMAPS Europe. All Rights Reserved | Privacy Policy | Imprint