The Nordic Conference on Microelectronics Packaging
The IMAPS Nordic 2019
Nordic Conference on Microelectronics Packaging, NordPac
in technical co-sponsorship with IEEE CPMT
was held at
Denmark’s Technical University (DTU), Lyngby, Denmerk
IMAPS Nordic and IEEE CPMT would like to thank the orgnanising committee in the successful organisation of the 2019 NordPac Conference!
The NordPac 2018 conference had over 40 participants contributing to a lively and friendly conference with two keynote speakers and 10 exhibitors. The proceedings from the conference can be found at IEEE here.