We are proud to announce that the 2019 NordPac conference will be held in Denmark. The event brand NordPac was introduced in Gothenburg in 2017 as a collaboration between IMAPS Nordic and IEEE EPS Nordic. The conference will take place at Technical University of Denmark, Lyngby, Denmark. For registration, please go to our conference portal.
|Abstract deadline:||5th of April, 2019 (Extended)|
|Final Paper submission deadline||For peer reviewed paper: May 1st 2019
For non-reviewed: May 22nd, 2019
|Conference||June 11th – 13th, 2019|
Full paper submission will aslo be done via our conference portal. Please provide three files:
All approved, reviewed, papers will be included in the conference proceedings and submitted for inclusion to IEEE Xplore Digital Library (www.ieeexplore.ieee.org) after the authors’ approval. The paper must be original and not previously published. Avoid inclusion of Commercial content.
For students we have the possibility to have papers classified as Reviewed and published in both IEEE Xplore and IMAPS North America IMAPSource, see http://ieeexplore.ieee.org/ and http://www.imapsource.org.
The deadline for the final paper is May 22, but if you want your paper to be reviewed deadline is May 1st. Late papers are not published.
If you require a VISA to enter Denmark, you may need an Invitation Letter. Please contact the organising commitee on Conference@nordpac.org to receive your letter. An invitation letter can only be issued to speakers.
As part of the annual IMAPS Nordic conference, PhD and Master Students are especially encouraged to submit an abstract. For this we have set up a Review process for those who need reviewed and published papers. This is a great opportunity to interact with the industrial and academic community at an international level (coming from inside and outside the Nordic countries).
|Printed, flexible electronics||Medical electronics|
|Unique materials, PTF and ACF||OPTO-ELECTRICAL and LED|
|High temperature electronics, harsh environment||Sensor integration & applications|
|3D Advanced interconnect, advanced packaging||Wearable electronics|
|Ceramics: thick film, copper plated, DBC, LTCC||Reliability assessments, SPC and FMEA|