IMAPS/IEEE NordPac 2018 – A Look Back

This year’s Scandinavian packaging conference NordPac took place from June 12^th to 14^th in Oulu/Finland, bringing its approx. 60 attendees to a place where the sun never sets (at this time of year, see image 1). With 30 technical talks, a bijou exhibition with 11 companies showcasing their work, two excursions, and a special course on reliability assessments, the hosts had prepared an event full of interesting opportunities for its attendees.

One particular focus of the conference was printed polymer-based electronics, which was certainly due to Oulu’s industrial scene, the home to several young enterprises working in the area. Other sessions addressed new developments in reliability, novel materials and processes, advanced packaging, and ceramic-based systems.

The conference can be called a real success with lots of opportunities for networking and specialist discussions among peers. Paul Collander, chairman of the event, and his team had planned carefully and managed the proceedings with characteristic precision.

The next NordPac will be opening its doors from June 11^th to 13^th, 2019, at the Technical University of Denmark.