Conference Program

For the full program with all details, please go to https://www.conftool.net/nordpac2024/sessions.php

Tuesday, 11 June 2024

Time Events Comments
10:00 – 13:00
Short course 1  by Dr. Martin Letz, Schott AG
“Semiconductor packaging using structured glass panels as platform” 
 For participants with full NordPac conference ticket.
13:00 – 13:45 Lunch break For participants with full NordPac conference ticket.
14:00 – 17:30 Next-Gen Packaging

 

 

Tickets available for participants registered with NordPac conference.

Notes: Limited number of tickets on “first comes first served” basis. Please register for this event during the registration for NordPac via conftool.

 14:00 Welcome and opening words

  • Business Finland, Business Tampere & IMAPS Nordic

14:10 Keynote: Advanced packaging and system integration

  • Martin Jaiser, Technical Project Management and Business Development, ASE

15:00 Growth from semiconductors

  • Tomy Runne, Chair of Semiconductor Branch Group, Technology Industries of Finland

15:20 Developments from Finnish Semiconductor Industry

  • Tomi Salo, Co-Creation Manager, Kvanttinova
  • Juha Purmonen, Executive Director, Photonics Finland
  • Mircea Guina, Professor, SiPFAB

15:50 Coffee break

16:20 Panel discussion: Future Visions and Opportunities of Packaging Industry

  • Moderator: Tuomas Hollman, Director, Bosch Sensortec
    Panelists:
  • Ville Hevonkorpi, Managing Director, Schott Primoceler
  • Senni Laaksonen, Vice President, Research and Development, Murata
  • Veijo Kontas, Head of SoC, Nokia Mobile Network
  • Martin Jaiser, Technical Project Management and Business Development, ASE

17:00 NordPac exhibitors and sponsors brief introductions
18:00 – 21:00 Welcome Reception

Arranged by NordPac, in collaboration with Business Finland and Business Tampere

For participants registered for the collaborative technical event.
  • Welcome words
  • Networking
  • Light dinner
  • Meet NordPac 2024 Exhibitors and Sponsors

 

Wednesday, 12 June 2024

Time Events Comments
09:00 – 11:00 Short course 2 by Dr. Attila Géczy, Budapest University of Technology and Economics

“Sustainable materials electronics”

 For participants with full NordPac conference ticket.
08:00 – 11:00 Exhibition setup Open for exhibitors
11:00 – 11:30 Coffee and Tea break in exhibition area
11:30 – 11:45 Opening session
11:30 – 17:00 Exhibition Open for all registered participants
11:45 – 12:15 Keynote 1 by Ralph W. Bernstein (PhD), SINTEF Digital, Norway

“The European Chips Act: Opportunities and Challenges”

 For participants with full NordPac conference ticket.
12:15 – 13:00 Lunch break For participants with full NordPac conference ticket.
13:00 – 13:45 Keynote 2 by Professor Leena Ukkonen, Tampere University, Finland

“Textile-based Wearable Antennas and Interconnections in Body-centric Wireless Systems”

 For participants with full NordPac conference ticket.
13:45 – 14:15 Coffee and Tea break in exhibition area
14:15 – 16:45 Hybrid photonics workshop chaired by Professor Mircea Guina, Tampere University, Finland

“Photonics-electronics integration and co-packaging. From technology to applications”

 Workshop program

For participants with full NordPac conference ticket.
19:00 – 22:00 Conference Dinner  For participants with dinner ticket.

 Location: Ravintola Myllarit. Åkerlundinkatu 4, 33100 Tampere.

 

Thursday, 13 June 2024

Time Events Comments
09:00 – 11:00 Technical sessions  For participants with full NordPac conference ticket.
11:00 – 11:30 Coffee and Tea break in exhibition area
11:30 – 12:15 Keynote 3 by Dr. Olli Salmela, Nokia Bell Labs

“From Reliability of Mobile Phone Packages to Advanced Solutions for Telecom Base Stations and Renewable Energy”

  For participants with full NordPac conference ticket.
12:15 – 13:00 Lunch break  For participants with full NordPac conference ticket.
13:00 – 15:00 Technical sessions  For participants with full NordPac conference ticket.
15:00 – 15:15 Coffee and Tea break in exhibition area
15:15 – 15:45 Keynote 4 by Dr. Shailesh Singh Chouhan, Luleå University of Technology, Sweden

“A Fully Additive Manufacturing Approach for the Fabrication of Interconnects, Onboard, and Embedded Passives for HDI-Printed Circuit Boards”

  For participants with full NordPac conference ticket.
15:45 – 16:00 Closing session Closing Nordpac 2024. Announce NordPac 2025.