The Nordic Chapter of IMAPS, the International Microelectronics And Packaging Society, is a non-profit society for companies and institutions involved in electronics packaging and production. The society is committed to the spreading of knowledge and information in its field. This is achieved through distribution of relevant publications, such as Advancing Microelectronics and Microelectronics International to its members, but most of all through the IMAPS Nordic Annual Conference which is held in September in Denmark, Norway, Sweden, and Finland on a rotating schedule.
IMAPS Nordic welcomes professional members from companies, as well as students and staff from universities and institutes in the Nordic region.
The IMAPS Nordic Board has members elected for a period of two years by the Annual Meeting, which is held in conjunction with the Annual Conference according to the society bylaws. Please see below info on the current board and their contact details.
IMAPS Nordic has no staff and no office, and the Board works on a voluntary basis, with the kind support of its respective employers.
IMAPS Nordic Contact Details
Organisation No. 802005-3974, registered in Stockholm, Sweden
IMAPS Nordic 2016 Conference.
IMAPS Nordic is proud to announce the year 2016 conference in Norway. The conference will take place in the centre of the “Electronic Coast” of Norway hosting a range of high tech companies. Tønsberg is only 30 minutes from the Oslo-Torp airport (TRP) and 1 hour south of Oslo.
Speakers who have submitted abstracts will be notified of paper acceptance by email by April 7. For information on the conference click here.
For students we introduce the possibility to have the paper classified as Reviewed and Published in IMAPS North America’s iKnow, http://imapsource.org.
The deadline for the final paper is May 13, but if you want your paper to be reviewed deadline is May 2. Late papers are not published.
Proposed topics include:
|3D Advanced interconnect and packaging||Miniaturization|
|HDI laminates, embedding, flex||Nano materials|
|Ceramics: thick film, DBC, LTCC||MEMS, MOEMS|
|Harsh environment||High temperature Electronics|
|Pb and halogen free electronics, methods and consequences||Test methods, Reliability assessments, SPC and FMEA|
|Sensor integration & Applications||Internet of Things|
|Medical, e-health, hearing aids||Energy harvesting|
|Wearable Devices||Power modules|
|Oil well industry||Printed Electronics|
|Future electronics, trends & strategies||Electronic start-ups and Entrepreneurship|