Call for Papers
The NordPac Conference 2022
June 12 – 14 at Chalmers University of Technology, Gothenburg, Sweden
Jointly arranged by IMAPS Nordic and IEEE EPS Nordic
Submission is now closed.
Please click here for instructions on full paper submission.
Proposed topics of microelectronics and packaging include:
| Optoelectronics | Harsh environment Applications |
| Advanced Packaging | Electronics Reliability & Quality |
| Materials & Processes | Medical electronics |
| Power electronics | Wearable electronics |
| Green Technologies | Printed electronics |
| Advanced packaging for MEMS & sensors & sensor systems | |