Call for Papers

The NordPac Conference 2022

June 12 – 14 at Chalmers University of Technology, Gothenburg, Sweden

Jointly arranged by IMAPS Nordic and IEEE EPS Nordic

Submission is now closed.

Please click here for instructions on full paper submission.

Proposed topics of microelectronics and packaging include:

Optoelectronics Harsh environment Applications
Advanced Packaging Electronics Reliability & Quality
Materials & Processes Medical electronics
Power electronics Wearable electronics
Green Technologies Printed electronics
Advanced packaging for MEMS & sensors & sensor systems

 Call for papers (pdf)