Call for Papers

The NordPac Conference 2022

June 12 – 14 at Chalmers University of Technology, Gothenburg, Sweden

Jointly arranged by IMAPS Nordic and IEEE EPS Nordic

 

We are proud to announce that the 2022 NordPac conference will be held in Sweden.

The event brand NordPac was introduced in Gothenburg in 2017 as a collaboration between IMAPS Nordic and IEEE Electronics Packaging Society (EPS) Nordic. The conference will take place at Chalmers University of Technology, Gothenburg.

You are welcome to submit an abstract and suggestion for a paper to the NordPac Conference 2022. Instructions will be posted promtly when our abstract submission system is up and running.

The deadline for abstract submission is Tuesday March 1st ,2022.

Proposed topics of microelectronics and packaging include:

Optoelectronics Harsh environment Applications
Advanced Packaging Electronics Reliability & Quality
Materials & Processes Medical electronics
Power electronics Wearable electronics
Green Technologies Printed electronics
Advanced packaging for MEMS & sensors & sensor systems

 Call for papers (pdf)