Call for Papers
The NordPac Conference 2022
June 12 – 14 at Chalmers University of Technology, Gothenburg, Sweden
Jointly arranged by IMAPS Nordic and IEEE EPS Nordic
The event brand NordPac was introduced in Gothenburg in 2017 as a collaboration between IMAPS Nordic and IEEE Electronics Packaging Society (EPS) Nordic. The conference will take place at Chalmers University of Technology, Gothenburg.
You are welcome to submit an abstract and suggestion for a paper to the NordPac Conference 2022.
The deadline for abstract submission is Tuesday March 1st ,2022.
Proposed topics of microelectronics and packaging include:
|Optoelectronics||Harsh environment Applications|
|Advanced Packaging||Electronics Reliability & Quality|
|Materials & Processes||Medical electronics|
|Power electronics||Wearable electronics|
|Green Technologies||Printed electronics|
|Advanced packaging for MEMS & sensors & sensor systems|