Call for papers
We are proud to announce that the NordPac 2024 conference will be held at hotel Scandic Rosendahl in Tampere, Finland. This is a perfect opportunity for you to present your revolutionary work within the field of microelectronic packaging while enjoying the normally beautiful weather in Tampere in June.
PDF version of call for papers can be downloaded here.
Abstract submission
We hereby invite you to prepare an abstract for the conference. For NordPac 2024 we have expanded the possibilities for how you want to present you work. We will open three submission tracks:
- Track 1 will require a full paper submission (4-6 pages). Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. (http://ieeexplore.ieee.org/). These papers are to be evaluated for the “Best paper” award of the conference.
- Track 2 will only require an extended abstract (1-2 pages) and will only be published in the conference proceedings.
- Track 3 is reserved for commercial white papers (1-4 pages) and will only be published in the conference proceedings. Presentations from all three tracks can appear in the same technical session.
The abstract submission deadline for all three tracks is February 14th, 2024.
Acceptance will be given within February 28th. After this, the three tracks follow different submission deadlines as indicated in the table below.
For full instructions on how to submit your paper and information on review process flow, please go to www.nordpac.org
Summary of deadlines
| Conference portal open for submission | October 2023 |
| Abstract submission | February 14th , 2024 (Extended) |
| Feedback on abstract | February 28th, 2024 |
| Track 1 – Full paper submission | April 30th, 2024 |
| Track 2 – Extended abstract submission | May 15th, 2024 |
| Track 3 – Commercial white paper submission | May 15th, 2024 |
| Notification of acceptance of all submissions | June 1st, 2024 |
Topics
Proposed topics of microelectronics and packaging include:
| Optoelectronics | Harsh environment Applications |
| Advanced Packaging | Electronics Reliability & Quality |
| Unique materials, PTF and ACF | Medical electronics |
| Reliability assessments, SPC and FMEA | Wearable electronics |
| Green Technologies | Printed, flexible electronics |
| 3D Advanced interconnect, advanced packaging | Ceramics: thick film, copper plated, DBC, LTCC |
| Sensor integration & applications |
Materials and processes |
About the conference
The event brand NordPac was introduced in Gothenburg in 2017 as a collaboration between IMAPS Nordic and IEEE Electronics Packaging Society (EPS) Nordic. NordPac prides itself on being a small and specialised conference where networking is easy.
Reviewed papers will be published in IEEE-Xplore with a licence to publish. The Licence allows the author to retain the copyright for the work and can publish it six months after the work has been published in IEEE-Xplore.
More information to come.
