The 2026 IMAPS Nordic Microelectronics Packaging Conference and Exhibition, NordPac

9-11 June 2026

Stockholm, Sweden

IMAPS Nordic would like to welcome you to the IMAPS Nordic Microelectronics Packaging Conference and Exhibition, NordPac 2026, in Stockholm, Sweden. The event brings together both academics, as well as industry leaders, to discuss and debate state-of-the-art and future trends in microelectronics, packaging, integration, reliability testing, PCB design, assembly and manufacturing of electronics, optics, electronics in health tech, materials, Artificial Intelligence (AI), and Internet of Things (IoT) in electronics. This is the 62^nd event organised by IMAPS Nordic chapter, and we hope you will celebrate the milestone with us. So mark the dates 9-11 June 2026 in your calendar today!

Preliminary program now available!

	Tuesday 9th of June		Wednesday 10th of June		Thursday 11th of June
8:00	Registration opens and morning snack	8:00-10:00	Doors open and morning snack	8:00-10:00	Doors open and morning snack
9:00-9:15	Opening session	9:00-9:45	Keynote	9:00-11:00	Technical session (parallel)
9:15-10:15	IEEE Distiguished Lecture by Jan Vardemann	9:45-10:00	Exhibitor presentation	11:00-11:45	Break
10.15-12:00	Lab tour and break at exhibition	10:00-10:15	Break	11:15-11:45	Keynote
12:00-13:00	Lunch	10:15-12:15	Technical session (parallel)	11:45-12:15	Closing session and best paper award
13:00-16:30	Panel discussion	12:15-13:15	Lunch
18:00->	Welcome reception	13:15-14:45	Short course
		14:45-15:00	Break
		15:00-17:00	APECS Workshop
		18:00-21:00	Boat tour and conference dinner

Available sessions

IEEE Distinguished Lecture by Jan Vardamann

Growth Drivers and Limits for Advanced Packaging in the AI Data Center Era

Keynote: Prof. Attila Géczy, Budapest University of Technology and Economics

PLA-Based Sustainable PCBs – a Possible Path for Greener Electronics

Short course: Dr. Naveen Tiwari, Postdoctoral Research Fellow, Faculty of Medicine and Health Technology, Tampere University

Self-healing materials for soft electronics

Panel discussion chaired by Professor Mikael Östling

Professor of solid state electronics at KTH, Royal institute of Technology, Stockholm

Panel on Packaging for quantum technology, power and emerging technologies

Workshop on Chiplet Integration Technologies powered by APECS

Felix Mohn, Business Development, APECS Pilot line

Rolf Aschenbrenner, Deputy Director and Head of Business Development Team, Fraunhofer Institute for Reliability and Mictrointegration (IZM)

Call for Exhibitors

It is our pleasure to announce Exhibitor opportunities for Nordic Conference and Exhibition on Microelectronics and Packaging, NordPac 2026. This is the 62nd event organized by IMAPS Nordic and is held on 9th – 11th June in Stockholm, Sweden.

The NordPac conference is a strong platform that brings together academics, as well as industry leaders, to discuss and debate state-of-the-art and future trends for example in the areas of microelectronics, packaging, integration, reliability testing, PCB design, assembly and manufacturing of electronics, optics, electronics in health tech, materials, Artificial Intelligence (AI), and Internet of Things (IoT) in electronics.

NordPac offers you a combination of interesting technical sessions with the latest news in the field and an interactive exhibition. The exhibition enables direct onsite interaction between participants. The welcome reception, coffee breaks, and the conference dinner are great platforms for networking with your academic and industry colleagues. We have received positive feedback on creating open and warm atmosphere in our events.

Exhibitor opportunities

Exhibitor type	Price	Includes
One table	1300 €	1 free participant Place at the exhibition + exhibitor presentations Logo in Conference Booklet and NordPac website LinkedIn post at IMAPS Nordic
Two tables	2300 €	2 free participants Place at the exhibition + exhibitor presentations Logo in Conference Booklet and NordPac website LinkedIn post at IMAPS Nordic