IEEE-EPS Distinguished Lecture by John Lau
Lateral Communication between Chiplets (Bridges) for Heterogeneous Integration
John H Lau
Unimicron Technology Corporation
|Chiplet design and heterogeneous integration packaging have been generated lots of tractions lately. For the next few years, we will see more implementations of a higher level of chiplet designs and heterogeneous integration packaging, whether it is for cost, time-to-market, performance, form factor, or power consumption. In this lecture, the following topics will be covered.
John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging, has published more than 515 peer-reviewed papers (375 are the principal investigator), 40 issued and pending US patents (25 are the principal inventor), and 23 textbooks (all are the first author), e.g., Chiplet Design and Heterogeneous Integration Packaging (Springer, 2023). John is an Fellow of IEEE, ASME, and IMAPS, and has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share. He received many awards, e.g., the IEEE Components Packaging and Manufacturing Technology Field Award and ASME Worcester Reed Warner Medal.