Professor of Active Implantable Medical Devices (AIMD)
Director, MAISI Facility
School of Biomedical Engineering & Imaging Sciences
King’s College London, UK
Title: Reliability of Active Implantable Devices: can we predict, and prevent, failure?
|Most research on the reliability of AIMD has focused on the prevention of corrosive failure, by limiting the formation of liquid water over the active electronics parts of the implant. Whilst two approaches, conformal coating or rigid hermetic enclosures, are successfully used in CE and FDA approved devices, the hermetic enclosure is by far the most common.
The large titanium cases with only a few metal in glass feedthroughs in use nowadays are well established. For these, there is no attempt at predicting lifetime in use, the accumulated experience of thousands of years in use has demonstrated that they are sufficiently hermetic, provided poorly sealed batches can be identified and excluded before entering service. It has therefore been sufficient to rely on a simple pass/fail test, based on a leak rate calculated on un-aged packages.
However, as we create new treatments and interventions, using innovative technologies, new materials, and much smaller devices, this approach may no longer be satisfactory. In this talk, I will review the basic assumptions and methods to evaluate the reliability of new AIMD, and discuss whether, and how, we can predict, and prevent, failure.
|Dr. Dongkai Shangguan
Title: Interconnect Reliability: From the Chip to the System
|Interconnect reliability is critical to the reliability of semiconductor packaging and electronic systems. As newer forms of interconnects emerge to meet the demand for high density and high performance, interconnect reliability is becoming more complex and more critical. The growing adoption of heterogeneous integration leads to increased diversity of interconnects (with different geometries, materials, and interfaces) in the same package, with complex (and often interactive) reliability failure modes and mechanisms. Finer pitch interconnects in advanced packaging are more susceptible to failures due to electromigration, interfacial reactions etc. Wafer level packaging, Cu direct bonding and other advanced packaging technologies, present new considerations in interconnect reliability.
At the same time, as electronic products become more pervasive in application, interconnect reliability must be considered holistically with regard to environmental conditions, from thermal, mechanical, and thermomechanical, to electrical and electrochemical. High frequency applications demand considerations of interconnect materials for signal integrity. High thermal density and high current density can have increased impact on interconnect reliability. These considerations will impact reliability engineering for semiconductor devices, from design for reliability, to accelerated testing and analysis. Yet another important dimension for interconnect reliability involves sustainability of electronic products, which demands environmentally friendly materials and processes, such as no-clean soldering, lead-free soldering, low temperature soldering, etc. Understanding of the failure mechanisms for different interconnect materials at various levels (wafer, chip, package, and system) of the semiconductor package, is of great importance to interconnect reliability, and ultimately reliability of semiconductor devices and electronic systems.
Business development and marketing manager, Schott Primoceler, Finland
Title: Glass packaging as enabling element
|Glass properties as material already offer several benefits, such as its ability to withstand high temperatures and pressure, as well as its optical transparency and chemical inertness. Those benefits can further be put into use by wide range of processes. Development of glass processing has been fast during the past years and many industries can take advantage of the ongoing improvement. Capabilities, accuracies, speed and cost level have all taken significant steps and so made glass a feasible option to completely new industries and applications.|
|Dr. Maaike M. Visser Taklo
SVP Engineering, Sonitor Technologies AS, Norway
Title: The role of packaging in IoT product development
|“Internet of things” (IoT) products are coming to market at an overwhelming rate, slowed only by current global sourcing of electronic components. Scheduling of such product development is a complex puzzle of interrelated tasks with diverging timelines performed by teams with widespread and diverse expertise. The tasks can span from ASIC design to application development for a cloud service. Demonstration of compliance with regulatory standards is also on the task list. And somewhere in the middle, is packaging and ensuring design for robustness and reliability. How well are iteration cycles of the individual tasks understood across the team? And how does this influence overall speed to market, cost, quality and environmental sensitivity of products being launched?
At Sonitor, we develop small tags placed onto assets, staff or patients to provide location services for healthcare. MEMS microphones are included in the tags to receive and interpret ultrasound signals. Housing of a product with a sound channel is a critical design aspect. In this talk, packaging for optimized acoustic performance will be given particular attention. In addition, an overview of tasks required to launch such a product will be presented, focusing on the different iteration cycle times of each task and how packaging plays a role in that picture. Compromises needed to speed up the development cycle will also be discussed.
Director of Technology, NCAB GROUP
Title: Euro Chips act – The need for a full ecosystem approach
|Both the European Union and USA have realized the 100% dependency on Asian manufacturing of packaging level electronic. 8th of February 2022 EU released a proposal for European Chips Act, which now is subject to member states voting and approval. In the USA President Biden signed a similar Chips Act autumn 2022. Both these acts have a focus on bringing Semiconductor chips manufacturing to be more independent from Asian manufacturing.
The question raised has been whether the investments in Europe also includes up stream ecosystem such as Interposers and high end Printed Circuit Boards (PCBs). IPC has already started a lobbying activity to raise awareness of the full ecosystem from PCB and up to Semiconductor ICs. If we fail to cover this whole eco system, the investment of more than 43 Billon Policy Driven Euro will not have the wanted effect.